INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, TOKYO ELECTRON U.S. HOLDINGS, INC. FILES APPLICATION FOR "METHOD FOR PATTERNING FOR CHEMICAL MECHANICAL POLISHING (CMP) ISO-DENSE BIAS COMPENSATION USING Z-HEIGHT"

GENEVA, Sept. 30 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-kuTokyo, 107-6325), TOKYO ELECTRON U.S. HOLDINGS, INC. (401 S 1st StSuite 900Austin, Texas 78704) filed a patent application (PCT/US2025/015476) for "METHOD FOR PATTERNING FOR CHEMICAL MECHANICAL POLISHING (CMP) ISO-DENSE BIAS COMPENSATION USING Z-HEIGHT" on Feb 12, 2025. With publication no. WO/2025/198746, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GRZESKOWIAK, Jodi (NanoFab 300 South, 255 Fuller Rd.Suite 214Albany, New York 12203), POWER, Davi...