INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, TOKYO ELECTRON U.S. HOLDINGS, INC. FILES APPLICATION FOR "EXPANDABLE WAFER BONDER"

GENEVA, March 25 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-kuTokyo, 107-6325), TOKYO ELECTRON U.S. HOLDINGS, INC. (2400 Grove BoulevardAustin, Texas 78741) filed a patent application (PCT/US2024/036854) for "EXPANDABLE WAFER BONDER" on Jul 05, 2024. With publication no. WO/2025/058698, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GILDEA, Adam (NanoFab 300 South 255 Fuller Road, suite 214Albany, New York 12203), NETZBAND, Christopher (NanoFab 300 South 255 Fuller Road, suite 214Albany, New York 12203)

Abst...