INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, TOKYO ELECTRON U.S. HOLDINGS, INC. FILES APPLICATION FOR "DIE TO WAFER BONDING METHOD AND APPARATUS WITH THERMAL CONTACT DIE SHAPE CONTROL"

GENEVA, Oct. 6 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-kuTokyo, 107-6325), TOKYO ELECTRON U.S. HOLDINGS, INC. (401 S 1st StSuite 900Austin, Texas 78704) filed a patent application (PCT/US2025/017378) for "DIE TO WAFER BONDING METHOD AND APPARATUS WITH THERMAL CONTACT DIE SHAPE CONTROL" on Feb 26, 2025. With publication no. WO/2025/207257, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): D'ACHARD, Hans (Achtseweg Zuid 2115651 GW Eindhoven), DEVILLIERS, Anton (NanoFab 300 South, 255 Fuller Rd.Suite 214Albany, ...