INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, TOKYO ELECTRON U.S. HOLDINGS, INC., ADVANCED MICRO DEVICES, INC. FILES APPLICATION FOR "SIDEWALL METAL CONTACT INTEGRATION THROUGH THE DIRECT ETCH OF A MERGED SOURCE-AND-DRAIN CONTACT"

GENEVA, July 21 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-kuTokyo 107-6325), TOKYO ELECTRON U.S. HOLDINGS, INC. (2400 Grove BoulevardAustin, Texas 78741), ADVANCED MICRO DEVICES, INC. (2485 Augustine DriveSanta Clara, California 95054) filed a patent application (PCT/US2024/057331) for "SIDEWALL METAL CONTACT INTEGRATION THROUGH THE DIRECT ETCH OF A MERGED SOURCE-AND-DRAIN CONTACT" on Nov 25, 2024. With publication no. WO/2025/151200, the details related to the patent application was published on Jul 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SMITH, Jeffrey (NanoFab 300...