INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, SICLARITY, INC. FILES APPLICATION FOR "METHOD FOR DIE-TO-DIE HYBRID BONDING USING AN ADVANCED DISTRIBUTION MODEL"

GENEVA, Sept. 2 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-kuTokyo, 107-6325), SICLARITY, INC. (333 West Maude AvenueSuite 207Sunnyvale, California 94085) filed a patent application (PCT/US2025/016348) for "METHOD FOR DIE-TO-DIE HYBRID BONDING USING AN ADVANCED DISTRIBUTION MODEL" on Feb 18, 2025. With publication no. WO/2025/178884, the details related to the patent application was published on Aug 28, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FULFORD, H. Jim (NanoFab 300 South, 255 Fuller Rd.Suite 214Albany, New York 12203), MUKHOPADHYAY, Partha (NanoFab 300 South, 255 Fu...