INTERNATIONAL PATENT: TOKUYAMA CORPORATION, 株式会社トクヤマ FILES APPLICATION FOR "SILICON NITRIDE SINTERED SUBSTRATE AND METHOD FOR PRODUCING SAME"

GENEVA, May 5 -- TOKUYAMA CORPORATION (1-1, Mikage-cho, Shunan-shi, Yamaguchi7458648), 株式会社トクヤマ (山口県周南市御影町１番１号) filed a patent application (PCT/JP2024/037798) for "SILICON NITRIDE SINTERED SUBSTRATE AND METHOD FOR PRODUCING SAME" on Oct 23, 2024. With publication no. WO/2025/089309, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ANDO, Akihiro (c/o Tokuyama Corporation, 1-1, Mi...