GENEVA, Nov. 18 -- TOKIWA KOGYO CO., LTD. (2-190-9 Yamada, Nishi-ku, Sakai-shi, Osaka5938316), トキワ工業株式会社 (大阪府堺市西区山田２丁１９０番地９) filed a patent application (PCT/JP2025/008594) for "PACKAGING SYSTEM AND PACKAGING METHOD" on Mar 07, 2025. With publication no. WO/2025/234205, the details related to the patent application was published on Nov 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KONDO, Masafumi (c/o TOKIWA...