INTERNATIONAL PATENT: TIGNIS, INC. FILES APPLICATION FOR "DETERMINATION OF THIN FILM PATTERN TO COMPENSATE SUBSTRATE WARPAGE"

GENEVA, Sept. 10 -- TIGNIS, INC. (701 North 36th Street, Suite 340Seattle, Washington 98103) filed a patent application (PCT/US2025/017356) for "DETERMINATION OF THIN FILM PATTERN TO COMPENSATE SUBSTRATE WARPAGE" on Feb 26, 2025. With publication no. WO/2025/184185, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BIHANI, Abhishek (c/o Tignis, Inc.701 North 36th Street, Suite 340Seattle, Washington 98103), STODDARD, Ryan J. (c/o Tignis, Inc.701 North 36th Street, Suite 340Seattle, Washington 98103)

Abstract: A system ma...