INTERNATIONAL PATENT: TIANJIN LAIRD TECHNOLOGIES LIMITED FILES APPLICATION FOR "THERMAL INTERFACE MATERIALS INCLUDING SILANE COUPLING AGENTS FOR DECREASING MATERIAL HARDNESS AND/OR FOR REDUCING SPREADING OF MATERIAL (S) MIGRATING FROM THE THERMAL INTERFACE MATERIALS"

GENEVA, Jan. 25 -- TIANJIN LAIRD TECHNOLOGIES LIMITED (Building C3 & C4, Hong Tai Industry Park, No. 87 TaiFeng Road, TEDABinhai New Area, Tianjin 300457) filed a patent application (PCT/CN2024/105930) for "THERMAL INTERFACE MATERIALS INCLUDING SILANE COUPLING AGENTS FOR DECREASING MATERIAL HARDNESS AND/OR FOR REDUCING SPREADING OF MATERIAL (S) MIGRATING FROM THE THERMAL INTERFACE MATERIALS" on Jul 17, 2024. With publication no. WO/2026/016083, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HE, Landi (Building C3 & C4, H...