GENEVA, May 27 -- THREEBOND CO., LTD. (4-3-3 Minamiosawa, Hachioji-shi, Tokyo1920398), 株式会社スリーボンド (東京都八王子市南大沢四丁目３番地３) filed a patent application (PCT/JP2024/039533) for "TWO-PACK CURABLE RESIN COMPOSITION AND CURED OBJECT FORMED THEREFROM" on Nov 07, 2024. With publication no. WO/2025/105276, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(...