INTERNATIONAL PATENT: THE UNIVERSITY OF HONG KONG FILES APPLICATION FOR "SYSTEM AND METHOD FOR FORMING LARGE-AREA ELECTRONIC-GRADE METAL CHALCOGEN THIN FILMS"

GENEVA, March 24 -- THE UNIVERSITY OF HONG KONG (Pokfulam RoadHong Kong 999077) filed a patent application (PCT/CN2024/116720) for "SYSTEM AND METHOD FOR FORMING LARGE-AREA ELECTRONIC-GRADE METAL CHALCOGEN THIN FILMS" on Sep 04, 2024. With publication no. WO/2025/055787, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LI, Lain-Jong (7F-1 No 8, Guanxin North Road,Hsinchu City, Taiwan 300), WAN, Yi (28B, Artisan House, 1 Sai Yuen LaneHong Kong 999077), CHANG, Yu-Ming (4F-3, Block C, Hoi Tao Building, Sai WanHong Kong 999077...