INTERNATIONAL PATENT: THE UNIVERSITY OF HONG KONG FILES APPLICATION FOR "HOT END FOR 3D PRINTING OF COLOR AND STRUCTURAL GRADIENT CERAMIC VIA FUSED DEPOSITION MODELING"

GENEVA, March 30 -- THE UNIVERSITY OF HONG KONG (Pokfulam RoadHong Kong) filed a patent application (PCT/CN2024/116231) for "HOT END FOR 3D PRINTING OF COLOR AND STRUCTURAL GRADIENT CERAMIC VIA FUSED DEPOSITION MODELING" on Sep 02, 2024. With publication no. WO/2025/060867, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TSOI, Kit Hon (Flat D, 29/F, Tower 4, Harbour Place, Hunghom, KowloonHong Kong), ZHANG, Yuqiang (Flat D, 22/F, Resiglow Bonham, No.8 Hing Hon RoadHong Kong), ZHANG, Junjing (Flat D, 22/F, Resiglow Bonham,...