INTERNATIONAL PATENT: THE UNIVERSITY OF HONG KONG FILES APPLICATION FOR "A METHOD FOR DOPING OF A MATERIAL, A METHOD OF FABRICATING AN ELECTRONIC DEVICE AND AN ELECTRONIC DEVICE"

GENEVA, Sept. 8 -- THE UNIVERSITY OF HONG KONG (Pokfulam RoadHong Kong 999077) filed a patent application (PCT/CN2025/078259) for "A METHOD FOR DOPING OF A MATERIAL, A METHOD OF FABRICATING AN ELECTRONIC DEVICE AND AN ELECTRONIC DEVICE" on Feb 20, 2025. With publication no. WO/2025/180285, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LU, Yang (HW 7-03, Haking Wong Building, The University of Hong Kong PokfulamHong Kong 999077)

Abstract: A method for doping of a material, a method of fabricating an electronic device ...