INTERNATIONAL PATENT: THE UNIVERSITY OF CHICAGO FILES APPLICATION FOR "ENCAPSULATED FLYWHEEL ACTUATION MODULES AND METHODS AND SYSTEMS FOR USING, DESIGNING AND PROTOTYPING WITH FLYWHEEL ACTUATION MODULES"

GENEVA, May 28 -- THE UNIVERSITY OF CHICAGO (5801 S. Ellis AvenueChicago, Illinois 60637) filed a patent application (PCT/US2024/054560) for "ENCAPSULATED FLYWHEEL ACTUATION MODULES AND METHODS AND SYSTEMS FOR USING, DESIGNING, AND PROTOTYPING WITH FLYWHEEL ACTUATION MODULES" on Nov 05, 2024. With publication no. WO/2025/106301, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YANG, Yunqi (c/o The University of Chicago5801 S. Ellis AvenueChicago, Illinois 60637), NAKAGAKI, Ken (c/o The University of Chicago5801 S. Ellis Av...