INTERNATIONAL PATENT: THE OPEN UNIVERSITY FILES APPLICATION FOR "METHOD OF JOINING A FIRST SURFACE TO A SECOND SURFACE BY HOT ISOSTATIC PRESSING WITHOUT ENCAPSULATION OF THE SURFACES, CORRESPONDING BONDED COMPONENT AND METHOD OF PREPARING SUCH TWO SURFACES"

GENEVA, Dec. 15 -- THE OPEN UNIVERSITY (Walton HallMilton Keynes MK7 6AA) filed a patent application (PCT/GB2025/051044) for "METHOD OF JOINING A FIRST SURFACE TO A SECOND SURFACE BY HOT ISOSTATIC PRESSING WITHOUT ENCAPSULATION OF THE SURFACES, CORRESPONDING BONDED COMPONENT, AND METHOD OF PREPARING SUCH TWO SURFACES" on May 15, 2025. With publication no. WO/2025/253084, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHIRZADI, Amir A. (c/o The Open UniversityWalton HallMilton Keynes MK7 6AA)

Abstract: The present invent...