INTERNATIONAL PATENT: THE JOHNS HOPKINS UNIVERSITY FILES APPLICATION FOR "SYSTEMS AND METHODS OF THIN FILM THERMOELECTRIC DEVICE FABRICATION"

GENEVA, May 27 -- THE JOHNS HOPKINS UNIVERSITY (3400 N. Charles StreetBaltimore, MD 21218) filed a patent application (PCT/US2024/046792) for "SYSTEMS AND METHODS OF THIN FILM THERMOELECTRIC DEVICE FABRICATION" on Sep 13, 2024. With publication no. WO/2025/106150, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): VENKATASUBRAMANIAN, Rama (c/o The Johns Hopkins University Applied Physics Laboratory11100 John Hopkins RoadMail Stop 7-127Laurel, Maryland 20723), HUBBARD, Matthew D. (c/o The Johns Hopkins University Applied Phys...