INTERNATIONAL PATENT: THE JOHNS HOPKINS UNIVERSITY FILES APPLICATION FOR "METAL-BONDED SUBSTRATES FOR DEVICES, THERMOELECTRIC MODULES AND THERMOELECTRIC ARRAYS"

GENEVA, Dec. 16 -- THE JOHNS HOPKINS UNIVERSITY (34th and Charles StBaltimore, Maryland 21218) filed a patent application (PCT/US2025/022996) for "METAL-BONDED SUBSTRATES FOR DEVICES, THERMOELECTRIC MODULES, AND THERMOELECTRIC ARRAYS" on Apr 03, 2025. With publication no. WO/2025/254724, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): VENKATASUBRAMANIAN, Rama (c/o The Johns Hopkins University11100 Johns Hopkins Road, M/S 7-129Laurel, Maryland, 20723), PIERCE, Jonathan M. (c/o The Johns Hopkins University11100 Johns Hopkin...