INTERNATIONAL PATENT: THE INDIUM CORPORATION OF AMERICA FILES APPLICATION FOR "PRE-ATTACHED ENGINEERED SOLDERS FOR ULTRA-LOW RESIDUE SOLDERING"

GENEVA, July 21 -- THE INDIUM CORPORATION OF AMERICA (301 Woods Park DriveClinton, New York 13323) filed a patent application (PCT/US2025/010596) for "PRE-ATTACHED ENGINEERED SOLDERS FOR ULTRA-LOW RESIDUE SOLDERING" on Jan 07, 2025. With publication no. WO/2025/151437, the details related to the patent application was published on Jul 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HERTLINE, Joseph M. (301 Woods Park DriveClinton, New York 13323), SOCHA, David P. (301 Woods Park DriveClinton, New York 13323)

Abstract: Some implementations of the disclosure are directed to a method inc...