INTERNATIONAL PATENT: THE CHINESE UNIVERSITY OF HONG KONG FILES APPLICATION FOR "A PATH PLANNING METHOD FOR 3D PRINTING OF LATTICE MATERIALS"

GENEVA, Oct. 18 -- THE CHINESE UNIVERSITY OF HONG KONG (Shatin, New TerritoriesHong Kong 999077) filed a patent application (PCT/CN2025/082840) for "A PATH PLANNING METHOD FOR 3D PRINTING OF LATTICE MATERIALS" on Mar 17, 2025. With publication no. WO/2025/214082, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SONG, Xu (Shatin, New TerritoriesHong Kong 999077), DING, Junhao (Shatin, New TerritoriesHong Kong 999077), QU, Shuo (Shatin, New TerritoriesHong Kong 999077)

Abstract: A path planning method for three-dimensional ...