INTERNATIONAL PATENT: TEXAS INSTRUMENTS INCORPORATED FILES APPLICATION FOR "WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLOCKING MATERIAL AND METHODS"

GENEVA, July 10 -- TEXAS INSTRUMENTS INCORPORATED (P. O. Box 655474, Mail Station 3999Dallas, TX 75265-5474) filed a patent application (PCT/US2024/061326) for "WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLOCKING MATERIAL AND METHODS" on Dec 20, 2024. With publication no. WO/2025/144720, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KOMATSU, Daiki (T-square 11-201 KitaiyuBeppu-shi Oita-ken, 8790845), MATSUURA, Masamitsu (2-1, KagemawashinoyumachiBeppu-shi Oita-ken, 8740025)

Abstract: A described ...