INTERNATIONAL PATENT: TEXAS INSTRUMENTS INCORPORATED FILES APPLICATION FOR "SEMICONDUCTOR DEVICE PACKAGE WITH STUB LEADS AND METHODS"

GENEVA, Dec. 10 -- TEXAS INSTRUMENTS INCORPORATED (P.o. Box 655474, Mail Station 3999Dallas, TX 75265-5474) filed a patent application (PCT/US2025/030566) for "SEMICONDUCTOR DEVICE PACKAGE WITH STUB LEADS AND METHODS" on May 22, 2025. With publication no. WO/2025/250434, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Han, Meng (26, Jalan Damai Impian 2/9a,Taman Damai Impian 2Cheras, Kuala Lumpur, 56000), BIN ABDUL AZIZ, Anis, Fauzi (No. 9, Lorong 2Jalan D1, Taman Dahlia, Bukit BeruangMelaka, 75350), HOW, You, Chye (...