INTERNATIONAL PATENT: TEXAS INSTRUMENTS INCORPORATED FILES APPLICATION FOR "BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PACKAGING"

GENEVA, March 10 -- TEXAS INSTRUMENTS INCORPORATED (P.O. Box 655474, Mail Station 3999Dallas, TX 75265-5474) filed a patent application (PCT/US2023/086502) for "BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PACKAGING" on Dec 29, 2023. With publication no. WO/2025/048875, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MOLINA, John, Carlo (100 P. Burgos St. Wawa Limay BataanLimay, 2103), ESTERON, Connie (West Industrial EstatePampanga, 2010), BUCASAS, Cesar (West Industrial EstatePampanga, 2010)

Abstract...