INTERNATIONAL PATENT: TESA SE FILES APPLICATION FOR "REACTIVE ADHESIVE TAPE, REACTIVE ADHESIVE TAPE SYSTEM, BONDED ASSEMBLY AND METHOD FOR ELECTRICALLY DEBONDING THE BONDED ASSEMBLY"

GENEVA, July 29 -- TESA SE (Hugo-Kirchberg-Str. 122848 Norderstedt) filed a patent application (PCT/EP2024/084779) for "REACTIVE ADHESIVE TAPE, REACTIVE ADHESIVE TAPE SYSTEM, BONDED ASSEMBLY AND METHOD FOR ELECTRICALLY DEBONDING THE BONDED ASSEMBLY" on Dec 05, 2024. With publication no. WO/2025/153229, the details related to the patent application was published on Jul 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SCHUH, Dr. Christian (c/o tesa SE; Hugo-Kirchberg-Str. 122848 Norderstedt), WANG, Dr. Shuang (c/o tesa SE; Hugo-Kirchberg-Str. 122848 Norderstedt), KEITE-TELGENBUSCHER, Dr. Kl...