GENEVA, Oct. 4 -- TESA SE (Hugo-Kirchberg-Str. 122848 Norderstedt) filed a patent application (PCT/EP2025/056687) for "MULTILAYER BONDING ELEMENT AND METHOD OF PARTING A BOND" on Mar 12, 2025. With publication no. WO/2025/201875, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KEITE-TELGENBUSCHER, Klaus (c/o tesa SE; Hugo-Kirchberg-Str. 122848 Norderstedt), KOOPS, Arne (c/o tesa SE; Hugo-Kirchberg-Str. 122848 Norderstedt), WANG, Shuang (c/o tesa SE; Hugo-Kirchberg-Str. 122848 Norderstedt)
Abstract: The invention relates ...