INTERNATIONAL PATENT: TESA SE FILES APPLICATION FOR "METHOD FOR CUTTING MULTI-LAYER ADHESIVE STRIPS BY MEANS OF A SHEARING CUT"

GENEVA, May 19 -- TESA SE (Hugo-Kirchberg-Str. 122848 Norderstedt) filed a patent application (PCT/EP2024/081254) for "METHOD FOR CUTTING MULTI-LAYER ADHESIVE STRIPS BY MEANS OF A SHEARING CUT" on Nov 06, 2024. With publication no. WO/2025/099022, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): OTT, Carsten (c/o tesa SE, Hugo-Kirchberg-Str. 122848 Norderstedt), EHLERS, Bruce Dirk (c/o tesa SE, Hugo-Kirchberg-Str. 122848 Norderstedt), JAWORSKI, Keno (c/o tesa SE, Hugo-Kirchberg-Str. 122848 Norderstedt)

Abstract: The inv...