INTERNATIONAL PATENT: TESA SE FILES APPLICATION FOR "ADHESIVE TAPE, BONDED ASSEMBLY AND METHOD FOR ELECTRICALLY DISSOLVING THE BONDED ASSEMBLY"

GENEVA, Feb. 24 -- TESA SE (Hugo-Kirchberg-Str. 122848 Norderstedt) filed a patent application (PCT/EP2024/071772) for "ADHESIVE TAPE, BONDED ASSEMBLY AND METHOD FOR ELECTRICALLY DISSOLVING THE BONDED ASSEMBLY" on Aug 01, 2024. With publication no. WO/2025/036715, the details related to the patent application was published on Feb 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DOCKWEILER, Dennis (c/o tesa SE; Hugo-Kirchberg-Str. 122848 Norderstedt), WANG, Shuang (c/o tesa SE; Hugo-Kirchberg-Str. 122848 Norderstedt), EGGER, Michael (c/o tesa SE; Hugo-Kirchberg-Str. 122848 Norderstedt), MO...