INTERNATIONAL PATENT: TERASI AB FILES APPLICATION FOR "INTEGRATED CIRCUIT PACKAGE"

GENEVA, July 21 -- TERASI AB (Kolviksvagen 38139 33 Varmdo) filed a patent application (PCT/SE2025/050016) for "INTEGRATED CIRCUIT PACKAGE" on Jan 10, 2025. With publication no. WO/2025/151071, the details related to the patent application was published on Jul 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GOMEZ TORRENT, Adrian (Fyrverkaregatan 4B, Lgh 110141 321 Goteborg), BEUERLE, Bernhard (Alekarrsvagen 1170 61 Solna), CAMPION, James (Kolviksvagen 38139 33 Varmdo)

Abstract: The abstract describes an integrated circuit package comprising a first package layer having a first package...