INTERNATIONAL PATENT: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED, 腾讯科技（深圳）有限公司 FILES APPLICATION FOR "METHOD AND APPARATUS FOR SETTING LAYER CONNECTION POINT IN MULTI-LAYER QUANTUM CHIP, ELECTRONIC DEVICE, MULTI-LAYER QUANTUM CHIP, COMPUTER READABLE STORAGE MEDIUM AND COMPUTER PROGRAM PRODUCT"

GENEVA, Sept. 28 -- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED (35/F, Tencent Building, Kejizhongyi Road, Midwest District of Hi-tech Park, Nanshan District,Shenzhen, Guangdong 518057), 腾讯科技（深圳）有限公司 (中国广东省深圳市南山区高新区科技中一路腾讯大厦35层) filed a patent application (PCT/CN2024/131540) for "METHOD AND APPARATUS FOR SETTING LAYER CONNECTION POINT IN MULTI-LAYER QUANTUM CHIP, ELECTRONIC DEVICE, MULTI-LAYER QUANTUM CHIP, COMPUTER READABLE STORAGE MEDIUM, AND COMPUTER PROGRAM PRODUCT" on Nov 12, 2024. With...