INTERNATIONAL PATENT: TENCENT AMERICA LLC FILES APPLICATION FOR "TRUNCATED BIT DEPTH SUPPORT SEI MESSAGES"

GENEVA, April 21 -- TENCENT AMERICA LLC (2747 Park BoulevardPalo Alto, California 94306) filed a patent application (PCT/US2024/051121) for "TRUNCATED BIT DEPTH SUPPORT SEI MESSAGES" on Oct 11, 2024. With publication no. WO/2025/081098, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WENGER, Stephan (c/o Tencent America LLC2747 Park BoulevardPalo Alto, California 94306), ZHAO, Xin (c/o Tencent America LLC2747 Park BoulevardPalo Alto, California 94306), DING, Ding (c/o Tencent America LLC2747 Park BoulevardPalo Alto, Calif...