INTERNATIONAL PATENT: TEMPTIME CORPORATION FILES APPLICATION FOR "SYSTEM AND PROCESS FOR PRINTING ENCAPSULATED AND NON-ENCAPSULATED MATERIALS UTILIZING GELLING AGENTS"

GENEVA, June 4 -- TEMPTIME CORPORATION (116 American RoadMorris Plains, New Jersey 07950) filed a patent application (PCT/US2024/056755) for "SYSTEM AND PROCESS FOR PRINTING ENCAPSULATED AND NON-ENCAPSULATED MATERIALS UTILIZING GELLING AGENTS" on Nov 20, 2024. With publication no. WO/2025/111386, the details related to the patent application was published on May 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUFFMAN, Brian S. (c/o Temptime Corporation116 American RoadMorris Plains, New Jersey 07950), DO, Thi N. (c/o Temptime Corporation116 American RoadMorris Plains, New Jersey 07950) ...