INTERNATIONAL PATENT: TELSONIC HOLDING AG FILES APPLICATION FOR "CONNECTION ELEMENT, CONTACT ARRANGEMENT AND METHOD FOR MANUFACTURING A CONTACT ARRANGEMENT"

GENEVA, Feb. 15 -- TELSONIC HOLDING AG (Industriestrasse 6b9552 Bronschhofen) filed a patent application (PCT/EP2023/071839) for "CONNECTION ELEMENT, CONTACT ARRANGEMENT, AND METHOD FOR MANUFACTURING A CONTACT ARRANGEMENT" on Aug 07, 2023. With publication no. WO/2025/031571, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DOBLER, Rafael (Beckingerstrasse 1a9552 Bronschhofen)

Abstract: The invention relates to an electrically conductive connection element (3) for establishing a connection to a first contact part (1). T...