INTERNATIONAL PATENT: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) FILES APPLICATION FOR "THERMAL VIA ARRANGEMENT FOR PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE"

GENEVA, Sept. 30 -- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (164 83 Stockholm) filed a patent application (PCT/SE2024/050261) for "THERMAL VIA ARRANGEMENT FOR PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE" on Mar 22, 2024. With publication no. WO/2025/198502, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NYLANDER, Emil (Dag Hammarskjolds Vag 8CSE-224 64 LUND)

Abstract: In an example, printed circuit board is provided comprising one or more first layers, one or more second layers, and one or more third layers between the o...