INTERNATIONAL PATENT: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) FILES APPLICATION FOR "LAYERED STRUCTURE ARRANGEMENT FOR THERMAL CONDUCTION FOR ELECTRONIC COMPONENTS"

GENEVA, July 3 -- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (SE-164 83 Stockholm) filed a patent application (PCT/SE2023/051290) for "LAYERED STRUCTURE ARRANGEMENT FOR THERMAL CONDUCTION FOR ELECTRONIC COMPONENTS" on Dec 20, 2023. With publication no. WO/2025/136162, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): POSHMAN, Goran (Nasbydalsvagen14, lgh 2502SE-18337 Taby), DAHLSTROM, Johanna (Silvergatan 5SE-19337 Sigtuna), MUSTAFA, Sara (Luthagsesplanaden 18SE-752 25 Uppsala)

Abstract: According to embodiments herein it is...