GENEVA, May 27 -- TEIJIN LIMITED (2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka5300005), 帝人株式会社 (大阪府大阪市北区中之島三丁目2番4号) filed a patent application (PCT/JP2024/040259) for "RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING SAME" on Nov 13, 2024. With publication no. WO/2025/105384, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): IWAZAKI, Masaki (c/o Teijin ...