INTERNATIONAL PATENT: TEIJIN LIMITED, 帝人株式会社 FILES APPLICATION FOR "LAMINATE FOR THERMOFORMING AND ARTICLE INCLUDING SAID LAMINATE"

GENEVA, Sept. 9 -- TEIJIN LIMITED (2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka5300005), 帝人株式会社 (大阪府大阪市北区中之島三丁目２番４号) filed a patent application (PCT/JP2025/003688) for "LAMINATE FOR THERMOFORMING, AND ARTICLE INCLUDING SAID LAMINATE" on Feb 05, 2025. With publication no. WO/2025/182494, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): OKADA, Youhei (c...