INTERNATIONAL PATENT: TECTONIC-3D SWIP B.V. FILES APPLICATION FOR "FUSED DEPOSITION MODELING METHOD AND METHOD TO DISSOLVE A HIGH TEMPERATURE POLYCARBONATE SUPPORT USED IN THIS METHOD"

GENEVA, June 18 -- TECTONIC-3D SWIP B.V. (High Tech Campus 95656 AE Eindhoven) filed a patent application (PCT/NL2024/050645) for "FUSED DEPOSITION MODELING METHOD AND METHOD TO DISSOLVE A HIGH TEMPERATURE POLYCARBONATE SUPPORT USED IN THIS METHOD" on Dec 03, 2024. With publication no. WO/2025/122008, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DUIS, Patrick Gerardus (Borkelsedijk 25571 GA Bergeijk)

Abstract: The invention pertains to a process for producing a three-dimensional target object by means of fused depos...