GENEVA, Jan. 13 -- TECHNO-UMG CO., LTD. (1-9-2, Higashi-Shimbashi, Minato-ku, Tokyo1050021), テクノＵＭＧ株式会社 (東京都港区東新橋一丁目９番２号) filed a patent application (PCT/JP2025/022253) for "THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF" on Jun 20, 2025. With publication no. WO/2026/009726, the details related to the patent application was published on Jan 08, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): FUJII, Shinji (c...