INTERNATIONAL PATENT: TDK ELECTRONICS AG FILES APPLICATION FOR "SUBSTRATE, HALF-BRIDGE, FULL BRIDGE, COMMUTATION CELL, ENSEMBLE AND MULTICOMPONENT STRUCTURE"

GENEVA, March 24 -- TDK ELECTRONICS AG (Rosenheimer Str. 141 e81671 MUNCHEN) filed a patent application (PCT/EP2024/075472) for "SUBSTRATE, HALF-BRIDGE, FULL BRIDGE, COMMUTATION CELL, ENSEMBLE AND MULTICOMPONENT STRUCTURE" on Sep 12, 2024. With publication no. WO/2025/056663, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KOINI, Markus (Erzherzog-Johann-Str. 38a8054 Seiersberg), PUFF, Markus (Am Blumenhang 29/28010 Graz), SCHNEDLITZ, Martin (Wielandgasse 388010 Graz)

Abstract: The invention relates to a flat substrate...