INTERNATIONAL PATENT: TDK ELECTRONICS AG FILES APPLICATION FOR "SENSOR ASSEMBLY AND METHOD FOR PRODUCING A SENSOR ASSEMBLY"

GENEVA, Nov. 24 -- TDK ELECTRONICS AG (Rosenheimer Str. 141 e81671 Munchen) filed a patent application (PCT/EP2025/062069) for "SENSOR ASSEMBLY AND METHOD FOR PRODUCING A SENSOR ASSEMBLY" on May 02, 2025. With publication no. WO/2025/237699, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WEHRING, Markus (Lotte-Pulewka-Str. 5514473 Potsdam), STRALLHOFER, Heinz (Unterlaufeneggerstr. 20 c8530 Deutschlandsberg), OH, Yeseul (Am Kollnischen Park 1110179 Berlin), THIEL, Benjamin (BahnhofstraBe 5414612 Falkensee), DEHOFF, Carste...