GENEVA, March 17 -- TDK ELECTRONICS AG (Rosenheimer Str. 141 e81671 Munchen) filed a patent application (PCT/EP2024/071016) for "SENSOR ASSEMBLY AND METHOD FOR PRODUCING A SENSOR ASSEMBLY" on Jul 24, 2024. With publication no. WO/2025/051440, the details related to the patent application was published on Mar 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): IHLE, Jan (Quellenweg 48074 Raaba-Grambach), HOJAS, Gerhard (Moosing 778565 Soding-St. Johann)
Abstract:
The invention relates to a sensor assembly (1) for measuring a temperature, comprising: - a sensor element (2) having a ceramic ...