INTERNATIONAL PATENT: TDK ELECTRONICS AG FILES APPLICATION FOR "MULTILAYER STRUCTURE AND PROCESS OF FORMING A MULTILAYER STRUCTURE"

GENEVA, Dec. 8 -- TDK ELECTRONICS AG (Rosenheimer Str. 141 e81671 Munchen) filed a patent application (PCT/EP2025/060577) for "MULTILAYER STRUCTURE AND PROCESS OF FORMING A MULTILAYER STRUCTURE" on Apr 16, 2025. With publication no. WO/2025/247554, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): VRABELJ, Marko (Apace 112A9253 Apace), GODARD, Nicolas (Norbert-Ehrlich-Siedlung 123/48530 Deutschlandsberg)

Abstract: A multilayer structure is provided that comprises a metal substrate and an electrode above the metal substrate...