INTERNATIONAL PATENT: TDK ELECTRONICS AG FILES APPLICATION FOR "CORE COMPONENT FOR A SENSOR ASSEMBLY AND SENSOR ASSEMBLY"

GENEVA, Sept. 29 -- TDK ELECTRONICS AG (Rosenheimer Str. 141 e81671 Munchen) filed a patent application (PCT/EP2025/053239) for "CORE COMPONENT FOR A SENSOR ASSEMBLY, AND SENSOR ASSEMBLY" on Feb 07, 2025. With publication no. WO/2025/195672, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WOHLGEMUTH, Christian (Kurfurstenstr. 70A12249 Berlin), KUSCHEL, Stefan (Friedrich-Naumann-Str. 75d14532 Stahnsdorf), ROHRBEIN, Sven (Eschenstr. 9a12161 Berlin), STENDEL, Thomas (Pramsdorfer Weg 615834 Rangsdorf)

Abstract: The invention...