INTERNATIONAL PATENT: TDK CORPORATION FILES APPLICATION FOR "CHIP COMPONENT AND MEMS MICROPHONE"

GENEVA, April 19 -- TDK CORPORATION (2-5-1, NihonbashiChuo-kuTokyo, 103-6128) filed a patent application (PCT/EP2024/077554) for "CHIP COMPONENT AND MEMS MICROPHONE" on Oct 01, 2024. With publication no. WO/2025/078203, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KISBAN, Sebastian (Trautweinstr. 14a81377 Munchen), SCHMIDT, Matthias (Abbachstr. 1580992 Munchen)

Abstract: The present application addresses a chip component for use in a MEMS setup as well as a MEMS microphone having such a chip component. The chip comp...