INTERNATIONAL PATENT: TDK CORPORATION, ＴＤＫ株式会社 FILES APPLICATION FOR "ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC CIRCUIT BOARD COMPRISING SAME"

GENEVA, Oct. 5 -- TDK CORPORATION (2-5-1, Nihonbashi, Chuo-ku Tokyo1036128), ＴＤＫ株式会社 (東京都中央区日本橋二丁目５番１号) filed a patent application (PCT/JP2025/004126) for "ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC CIRCUIT BOARD COMPRISING SAME" on Feb 07, 2025. With publication no. WO/2025/204183, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TESHIROGI Shota (c/o TDK Corporat...