INTERNATIONAL PATENT: TDK CORPORATION, ＴＤＫ株式会社 FILES APPLICATION FOR "ELECTRONIC COMPONENT AND SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT"

GENEVA, Feb. 17 -- TDK CORPORATION (2-5-1, Nihonbashi, Chuo-ku Tokyo1036128), ＴＤＫ株式会社 (東京都中央区日本橋二丁目５番１号) filed a patent application (PCT/JP2024/018610) for "ELECTRONIC COMPONENT AND SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT" on May 21, 2024. With publication no. WO/2025/032918, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TSUYUTANI Kazutoshi (c/o TDK Corpora...