GENEVA, July 8 -- TBM CO., LTD. (15th floor, Toho Hibiya Building, 1-2-2, Yurakucho, Chiyoda-ku, Tokyo1000006), 株式会社ＴＢＭ (東京都千代田区有楽町一丁目２番２号 東宝日比谷ビル１５階) filed a patent application (PCT/JP2024/044973) for "RESIN COMPOSITION AND MOLDED ARTICLE CONTAINING SAME" on Dec 19, 2024. With publication no. WO/2025/142724, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is m...