INTERNATIONAL PATENT: TANAKA DENSHI KOGYO K.K., 田中電子工業株式会社 FILES APPLICATION FOR "SILVER ALLOY WIRE AND CONDUCTIVE WIRE, WIRE FOR JOINING, WIRE FOR SEMICONDUCTOR AND WIRE FOR STRUCTURE USING SAME"

GENEVA, July 3 -- TANAKA DENSHI KOGYO K.K. (2303-15 Yoshida, Yoshinogari-cho, Kanzaki-gun, Saga8420031), 田中電子工業株式会社 (佐賀県神埼郡吉野ヶ里町吉田２３０３－１５) filed a patent application (PCT/JP2024/041681) for "SILVER ALLOY WIRE, AND CONDUCTIVE WIRE, WIRE FOR JOINING, WIRE FOR SEMICONDUCTOR, AND WIRE FOR STRUCTURE USING SAME" on Nov 25, 2024. With publication no. WO/2025/134698, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) sy...