INTERNATIONAL PATENT: TAIZHOU UNIVERSITY, 台州学院 FILES APPLICATION FOR "GRINDING DEVICE FOR GRINDING SMALL-DIAMETER, TALL SAMPLES AND USAGE METHOD THEREFOR"

GENEVA, Feb. 1 -- TAIZHOU UNIVERSITY (No.1139 Shifu Avenue, Jiaojiang DistrictTaizhou, Zhejiang 318000), 台州学院 (中国浙江省台州市椒江区市府大道1139号) filed a patent application (PCT/CN2025/103678) for "GRINDING DEVICE FOR GRINDING SMALL-DIAMETER, TALL SAMPLES, AND USAGE METHOD THEREFOR" on Jun 26, 2025. With publication no. WO/2026/021111, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHAO, Ling (No...