INTERNATIONAL PATENT: TAICA CORPORATION, 株式会社タイカ FILES APPLICATION FOR "CHIP PEELING METHOD, CHIP PEELING DEVICE AND CHIP MANUFACTURING METHOD"

GENEVA, Aug. 25 -- TAICA CORPORATION (18-10, Takanawa 2-chome, Minato-ku, Tokyo1080074), 株式会社タイカ (東京都港区高輪二丁目１８番１０号) filed a patent application (PCT/JP2024/005250) for "CHIP PEELING METHOD, CHIP PEELING DEVICE, AND CHIP MANUFACTURING METHOD" on Feb 15, 2024. With publication no. WO/2025/173171, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HAJI Hiroshi (c/o TAICA...