INTERNATIONAL PATENT: SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD., 苏州元脑智能科技有限公司 FILES APPLICATION FOR "BGA CHIP PACKAGING STRUCTURE AND TESTING METHOD"

GENEVA, Jan. 4 -- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD. (Building 9, No. 1 Guanpu Road, Guoxiang Street, Wuzhong ZoneSuzhou, Jiangsu 215000), 苏州元脑智能科技有限公司 (中国江苏省苏州市吴中区吴中经济开发区郭巷街道官浦路1号9幢) filed a patent application (PCT/CN2025/083224) for "BGA CHIP PACKAGING STRUCTURE AND TESTING METHOD" on Mar 18, 2025. With publication no. WO/2026/001111, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted...